China is expected to import more than 0 billion of chips this year, far more than a year's worth of oil, according to the industry body. As the most powerful chip demand in the country, consumption share of nearly 70 percent of the pearl river delta, but no advanced chip manufacturers. At a time when China is focusing on developing strategic emerging industries, this has to cause deep reflection on China's heartlessness.

On the whole, China's electronic components and components industry has made great progress in recent years, especially in military electronic components. However, the whole industry still faces many challenges. There is no shortage of money.

Status of China's chip industry

Chip manufacturing is mainly divided into three parts: wafer processing and manufacturing, chip pre-processing and chip post-packaging. The most difficult part is the pre-processing of chips, which is divided into hundreds of processes. Each process has corresponding equipment. Among these devices, the most difficult technology is lithography. China's semiconductor technology is mainly in the first and third links. Most of the technical equipment in the second link is blank, so the entire high-end chip needs to be imported.

After more than ten years of development, China's integrated circuit industry has made remarkable achievements. In the past ten years, the scale of integrated circuit industry has been growing rapidly. From 2007 to 2017, the average annual compound growth rate of China's integrated circuit industry was 15.8 percent, far higher than the global growth rate of 6.8 percent.

The most recent sales in January to March 2018 were 115.29 billion yuan, up 20.8 percent year-on-year. The design industry grew 22 percent year-on-year, with sales of 39.45 billion yuan. Manufacturing increased 26.2 percent year-on-year, with sales of 35.59 billion yuan. The packaging and testing industry grew 19.6 percent year-on-year, with sales of 42.5 billion yuan.

More happily, China's integrated circuit industry has become more balanced. From 2008 to 2017, after 10 years of development, China's integrated circuit industry has gradually formed a pattern of coordinated development of design, manufacturing and packaging testing. Among them, the design industry grows rapidly, and the industrial scale also exceeds the closed testing industry, and becomes the link with the largest proportion of output value, accounting for 38% at present.

High-end chip dependence is still high

While seeing China's chip progress, we also need to see the gap. At present, China's high-end IC design capacity is insufficient. The product range of China's chip design industry has covered almost all categories, and some products have a certain market scale, but China's chip products are still in the middle and low-end overall, and cannot compete with foreign products in the high-end market. In China, processors and memory chips account for more than 70 percent of the more than 0 billion in imports each year.

The gap between high-end general purpose chip and foreign advanced level is large, which is mainly reflected in four aspects.

1) the gap between domestic and foreign mobile processors is relatively small. Unisplendour, huawei hai si and other mobile processors in the world has advanced.

2) CPU is the most difficult high-end chip to catch up with. Intel has almost monopolized the global market. There are about 3-5 domestic related enterprises, but none of them have achieved commercial mass production. Most of them still rely on scientific research project funding and government subsidies to maintain their operation. Although domestic CPU design enterprises such as longxin can make CPU products and may surpass foreign cpus in single or partial indexes, they cannot compete with the dominant products due to lack of industrial ecological support.

3) large gap between domestic and foreign memory. Wuhan Yangtze storage is trying to develop 3D Nand Flash technology, but it is only at the 32-layer Flash prototype stage, while leading global companies such as samsung and Intel have begun mass production of 64-bit Flash products.

4) for high-end general-purpose chips such as FPGA and AD/DA, there is a huge gap in technology at home and abroad.

In particular, in the field of high-end chips and cpus, although the problem has been solved and the application has been realized in specific fields, the cost performance in the civilian market still needs to be improved. In the GPU field, only jingjia micro has a layout and serves special applications. In terms of FPGA, domestic companies like gao yun and ziguang guoxin have relatively low level of technology. In terms of storage, China does not yet have manufacturing capacity.

In the field of analog chip, the products of analog chip enterprises are concentrated in middle and low-end products, and the gap with the United States in high voltage, high frequency, high performance and high reliability is very significant. In terms of manufacturing devices, domestic companies like ziguang zhangrui have initially developed 4G power amplifiers, but their market competitiveness and device performance have a large gap with the advanced level. In terms of power electronic devices, domestic enterprises are weak except zhongche times electric company.

In the field of optical devices, domestic enterprises mainly produce medium and low-end optical devices, and over 95% of high-end devices are imported from abroad, and the comprehensive domestic production rate is less than 15%. Of the world's top 10 optoelectronics companies, only guangxun technology, a subsidiary of fiberhome group, ranks fifth, while its market share is only 5%. In the 100G opto-electronic transceiver market, domestic enterprises have zero market share.

In terms of equipment materials, only some of the equipment in China has achieved a single breakthrough, and the equipment such as plasma etching machine, MOCVD, cleaning agent has achieved localization, but does not yet have the complete process capacity for advanced processes. In terms of materials, China currently has certain technical strength in 8-inch silicon wafers, metal targets, copper electroplating solution, CMP grinding fluid, chemical reagent, etc., but its technical strength is still weak in 12-inch silicon wafers, special gases, high purity chemical reagents and other materials oriented to advanced technology.